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March 1999

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Date:
Tue, 23 Mar 1999 09:42:43 -0800
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Jorge,

Let me understand you correctly.  Did you say that you suspended the BGA
component "live bug" (right side up) above a stainless steel plate and
when the component reached reflow temperatures one or more solder balls
fell off? Did this happen on more than just a few units?

One sure way to fix this problem is to reball the BGA after making sure
the pads are wetting properly.  If these components are new then this is
really Intel's problem and not yours.  You may want to check the Technet
archives for some of my previous BGA issues and concerns.  Try searching
on "Defective BGA" in the subject field.

Or visit this link describing the "strikingly similar" BGA problems
which we are finding:

http://www.sixsigmaservices.com/defectivebga/

Regards, Russ Winslow

Six Sigma
1940 Concourse Drive
San Jose, CA  95131


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jorge Engenharia
Sent: Tuesday, March 23, 1999 5:31 AM
To: [log in to unmask]
Subject: [TN] Bga solder ball failure.


 Hi technos,

   We run PC boards with chipset INTEL 82371EB 324 pins and 82443BX 492
pins both BGA package.
   First we had bad performance due solder that comes under BGA through
the via holes located under the component during solder wave process. We
fixed that using adesive tape to cover the via holes during solder wave.
   After using the tape we still had solder short only at the small BGA
( 324 pins ). We bake some boards and components to verify if humidity
were causing some solder balls to splash away due high vapor formation
during reflow, but the problem still happened.
   We run some BGA parts ( 324 pins ) above one stainless steel plate
inside the oven and could observe that some balls drop off from the
package and splash under the component.
   The 492 pins BGA came from KOREA and the 324 pins BGA came from
PHILIPINES.

   My question:
   Why I had problem only at 324 pin BGA if both BGA are subject at the
same process enviroment ?
   Anybody had already problem with this BGA from PHILIPINES ?
   There is one way to avoid this problem ?

   Any help will be very apreciated.

Thanks

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