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March 1999

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Mar 1999 08:16:56 -0600
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Graham,
        Thanks for the reference, it provides some interesting
information. However, it is based on cleaning RMA fluxes, not OAs. Most
non-military assembly processes are using OA chemistries with straight
aqueous processes, or have moved towards no-clean. A robust high
pressure inline aqueous cleaner should handle most all low-profile
components soldered with OA chemistries, without the use of wash
additives. However, each assembly must be evaluated on its own merits
and tested under production conditions to assure adequate cleanliness
for the specified end-use environment.

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Graham Naisbitt [SMTP:[log in to unmask]]
> Sent: Tuesday, March 23, 1999 6:34 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] RF PCMCIAs and Cleanliness
>
> John
>
> It would appear that no-one answered your question. So if it is not
> too
> late...
>
> How clean is clean is a great big topic. There was an interesting
> article in
> the Feb 99 issue of Precision Cleaning magazine written by people at
> Lockheed Martin that covers this subject well. This is a USA journal
> and if
> you need details, ask me.
>
> They basically found that with low stand-off components, you MUST use
> wash
> chemistry to lower surface tension of the water to get it underneath
> AND
> remove the contaminant. However, it involves power - (wash pressure)
> as well
> as solvent power (wash chemistry).
>
> Regards, Graham Naisbitt
>
> [log in to unmask]
>
> Concoat Ltd             Phone: +44 1276 691100
> Alasan House          Fax:      +44 1276 691227
> Albany Park
> CAMBERLEY
> GU15 2PL UK
> -----Original Message-----
> From: John Gulley <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: 12 March 1999 17:24
> Subject: [TN] RF PCMCIAs and Cleanliness
>
>
> >Address,
> >
> >We have an application where we are using OA Flux and Paste to
> process
> >RF PCMCIAs.  The PCAs are thoroughly cleaned prior to test.  I'm
> still
> >having test issues with RF PCMCIAs.
> >
> >If I remember correctly, I read an article that discussed cleanliness
> of
> >PCAs that are RF.  If the PCA is not thoroughly cleaned, the organics
> >will wreak havoc on the RF tests.  There are chemistries (saponifers)
> >available that will reliable remove the excess organics and provide
> >enough cleanliness to pass RF testing.
> >
> >CAN someone please provide some more light onto this issue or give me
> a
> >direction to pursue, e.g., contacts.  Thanks.
> >
> >John
> >
> >
> >
> >
> >
>
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