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March 1999

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Subject:
From:
Jorge Engenharia <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 23 Mar 1999 10:30:46 -0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (39 lines)
 Hi technos,

   We run PC boards with chipset INTEL 82371EB 324 pins and 82443BX 492
pins both BGA package.
   First we had bad performance due solder that comes under BGA through
the via holes located under the component during solder wave process. We
fixed that using adesive tape to cover the via holes during solder wave.
   After using the tape we still had solder short only at the small BGA
( 324 pins ). We bake some boards and components to verify if humidity
were causing some solder balls to splash away due high vapor formation
during reflow, but the problem still happened.
   We run some BGA parts ( 324 pins ) above one stainless steel plate
inside the oven and could observe that some balls drop off from the
package and splash under the component.
   The 492 pins BGA came from KOREA and the 324 pins BGA came from
PHILIPINES.

   My question:
   Why I had problem only at 324 pin BGA if both BGA are subject at the
same process enviroment ?
   Anybody had already problem with this BGA from PHILIPINES ?
   There is one way to avoid this problem ?

   Any help will be very apreciated.

Thanks

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