Good Morning from Minnesota,

We are currently building a product that requires us to trim the leads,
after soldering, to .020". When we trim, we are literally cutting most of
the solder fillet off.  With the trim blade cutting into the solder first,
and not grabbing ont to the lead first, I think that is why we do not see
fractured solder.  In your opinion, do you think that is a fair assumption?
(and I really hate to a-s-s-u-m-e).  If so, do you think the solder
connections need to be 100% inspected under 10X magnification or reflowed,
as stated in the IPC 610B?

Thanks in advance for any input in this matter.

Connie Korth
K-Byte Manfacturing Hibbing

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