Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 22 Mar 1999 10:16:18 +0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Refer to ANSI/J-STD-004 in detail of IPC-TM-650 Test Method No.
2.6.3.3 Surface insulation Resistance,Fluxes. I would like to ask
you the following question:
1. Is this procedure can use for PCBA( Use actual PCBA after assy
as the sample board) because I understand that Test Method No.
2.6.3.3 use for identify effect of flux by SIR test and we
must prepare the specimen by flux which we want to test, But we
would like to test our PCBA(finish good) Can use this procedure
or not? Or have other specific method for SIR test of residue on
PCBA?Or use test coupon to simulate by pass thru our process?
2. We can use the following item for test all type& dimension of
sample which used to confirm our process ? :
- test condition(humidity,temperature-------------->85 C,85%RH
- test pattern size
- other parameter
Please answer my question and thank you for your response.
Patranit.
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|