I am looking for more recent material on the growth, care and feeding of
Au/Al intermetallics in gold ball on aluminum IC pad wire bonds than George
G. Harman's excellent though all too brief book, "Wire Bonding In
Microelectronics" with a 1989 copyright.  More specifically, I am interested
in known contaminants that reduce the time and/or temperature components
required to grow the intermetallic layer.  I would also like to know what a
"typical" intermetallic layer thickness is, if there is such a thing as
typical.

I would greatly appreciate if someone would at least refer me to relevant
material.

Thank you.

Neal Forss

fax:    (408) 738-8364
work:  (408) 522-6304
email:  [log in to unmask]

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