Well I dont know about the Mentor system, but to do the suggested shaped
pads (like the alternative MELF pattern) with cadstar for windows (&
this is only theory folks!)
I would create a component with a teensy weensy little pad and create
the rest of the shape for the pad with "Component Copper".
Also a slightly larger figure assigned to a "solder resist" layer for
making the solder resist mask.

Its a bit of a cowboy way to do it, but then it should work with a
W.Y.S.I.W.Y.G system.

I guess that I'm lucky in that our smallest component is 0805 (for now
at least) and we dont use glue yet (reflow only).


T.T.F.N

Matthew Lamkin
Printed Circuit Board Draughtsman
Protec Fire Detection PLC
Churchill Way,
Nelson, Lancs
BB9 6RT.
Tel 01282 717393
Fax 01282 717273
Email = [log in to unmask]

Company Web Site = http://www.protec-fire-detection.plc.uk


>-----Original Message-----
>From:  Larry Campbell [SMTP:[log in to unmask]]
>Sent:  Thursday, March 18, 1999 4:02 PM
>To:    [log in to unmask]
>Subject:       [TN] 0612 vs. 1206 -Reply
>
>What type of devices are these.  I haven't heard nor seen this style as of
>yet but would like to know some details.  Are you having them custom
>made?
>
>Larry Campbell
>BFGoodrich, Avionics Systems
>
>>>> Stuart Korringa <[log in to unmask]> 03/18/99 10:14am >>>
>     The EEs at my company are proposing using 0612 and 0508 chip
>     components instead of the traditional 1206 and 0805 styles. They
>have
>     electrical reasons to have the end metallization on the long dimension
>     instead of on the short ends. A problem comes up with SMT glue dot
>     since the pads on the board are then only .020 apart on the long
>     dimension. The glue dot will probably infringe on the pad area.
>
>     We have several suggestions on how to handle this issue including
>     intentionally putting glue on the pad area. I, with my Quality
>     Standard hat on, say that we should not do that. Others suggest a
>     sculpted pad to allow a wider space in the middle for the glue dot.
>
>     Another idea was to have 4 corner pads but 1) the Mentor CAD
>system
>     only allows for 2 pads on a 2 contact component and 2) the EEs want
>as
>     much part to pad contact as possible.
>
>     Does anyone have experience and input on this question?
>
>     TIA,
>
>     Stu Korringa
>     Smiths Industries
>     Grand Rapids, Mi 49512
>     616-241-8189
>     [log in to unmask]
>
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