Hello Technet,

Today I was looking for specifications regarding the amount of SMT glue that is allowed on the soldering pads.
The ANSI-J-STD001A and B both mention (in 6.2.9 and in 6.1.6) that "Adhesive materials shall not flow onto, or obscure, areas to be soldered". The word "shall" means that the requirement is only mandatory for Class 3 products.
IPC-A-610 revision B mentions in paragraph 10.1 that (for class 3) it is only a defect when there is less than 75 % minimum end joint width. 
I always understood that IPC-A-610 is a "pictorial interpretive document", so I don't understand the discrepancy ?
Which of the specs is right ?

Daan Terstegge
Signaal Communications
Unclassified

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