Does you company allow chip component to be placed up-side down, or on
it's side( vertical)?
If the answer is yes, what is maximum quantity you will allow for each
defect on each board?
So far I have heard  that many OEM company, like IBM and Seagate do
allow this kind of misplaced component on their boards.  but I have not
yet see a solid document from either of the company.   I decided to
bring up this question to the group, and see if we can do a quick
benchmark within the group on tihs subject.  Thanks for the time reading
this.

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