hi,
'g' is:
"for natural color of resin system f with a glass transition temperature
between 150 deg c and 200 deg c, etc., etc., etc,."
phil crepeau
-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: Thursday, March 18, 1999 12:08 PM
To: [log in to unmask]
Subject: Re: [TN] What the heck is MIL-P-13949
In a message dated 3/18/99 10:40:14 AM Pacific Standard Time,
[log in to unmask] writes:
<< I have a PCB spec which calls out "epoxy glass laminate per
MIL-P-13949".. My questions are:
1. Is this a callout for FR-4?
2. What does 13949 cover
3. If 13949 is correct, does it need additional info, such as type,
to be correct.
Thanks in advance for your help.>>
Hello Eldon!
My stencil still isn't here yet so here's what the dogpile found (It's a
whole bunch of threads on MIL-P-13949):
>>> "MEL WOOSLEY-PLANNING" <[log in to unmask]> 10/23 11:40 AM >>>
Hello --
I have a customer asking for material which meets MIL - P - 13949 type GFG.
As I do not have a
copy of this spec I am not sure about the GF " G". What is the last G
referring to?
Mel Woosley
South Bay Circuits
v 602.940.3125 x 132
f 602.940.6436
*********************************************************
MIL-P-13949 defines foil-clad laminate. These three character positions
identify the Base Material. The first two characters denote material and
the
third defines whether or not the base material has a coloring agent or
pacifier. N = without and P = with. Older drawings (i.e. have only the
first
two characters) created prior to this standard adopting this third character
position presume the material to be without ("N").
The first character is the reinforcement, second is the resin system, and if
the third is neither P nor N, then the second and third characters must
represent the same resin system.
*********************************************************
MIL-P-13949 was superceded by MIL-S-13949 in 1993. According to that
document, the third character being a "G" means: "Natural color of resin
system...with a glass transition temperature between [150 and 200 degrees
C]..." It is basically GFN with a specified Tg.
-bk
===============================================================
| Bob Kinney [log in to unmask]
| Electrical Packaging Specialist 612-912-3444(Voice)
| Digi International, Inc. 612-912-4956 (FAX)
| 11001 Bren Road E. "Any opinions expressed herein
| Minnetonka, MN 55343 should be considered personal"
===============================================================
****************************************************************************
**
****
The third letter is supposed to represent color and opacity, in GFN GF is
flame resistant epoxy filled glass cloth, the N stands for -none- or
natural, so in GFG -G- is most likely -Green-, I don't believe that MIL-
P-13949 actually states what a -G- stands for.
FYI........
****************************************************************************
**
**********
MIL-S-13949, all associated specification sheets, the associated
qualification
program and QPL-13949 are scheduled to be canceled November 30, 1998.
Responses to this cancellation can be sent to Monica Poelking (DSCC-VAC).
Monica can be reached by the following:
(614)692-0674
[log in to unmask]
or write to:
Defense Logistics Agency
Defense Supply Center, Columbus
Post Office Box 3990
Columbus, OH 43216-5000
Thanks
Anthony T. Cosentino
Lockheed Martin
(703)367-1144
[log in to unmask]
****************************************************************************
**
********
Keith Larson ([log in to unmask])
Thu, 11 Sep 1997 21:48:52 -0500
*Messages sorted by: [ date ][ thread ][ subject ][ author ]
*Next message: Patrick Ducas: "[TECHNET] Looking for a paper"
*Previous message: Gregg Klawson: "[TECHNET] Assy: Non-silicone elastormeric
thermal pad"
John,
One (1) ounce copper is .0014" (35.0 microns) thick and has a tolerance of
+-10% for Class 1 and +-5% for Class 2.
Keith Larson
Circuit Technology Inc.
At 01:10 PM 9/11/97 +0000, you wrote:
>COuld someone please tell me what the thickness and tolerance of 1oz
>base Cu is called out as per MIL-P-13949/4.
>
>Much Appreciated
>
>Regards
>
>John Parsons
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
