The EEs at my company are proposing using 0612 and 0508 chip
     components instead of the traditional 1206 and 0805 styles. They have
     electrical reasons to have the end metallization on the long dimension
     instead of on the short ends. A problem comes up with SMT glue dot
     since the pads on the board are then only .020 apart on the long
     dimension. The glue dot will probably infringe on the pad area.

     We have several suggestions on how to handle this issue including
     intentionally putting glue on the pad area. I, with my Quality
     Standard hat on, say that we should not do that. Others suggest a
     sculpted pad to allow a wider space in the middle for the glue dot.

     Another idea was to have 4 corner pads but 1) the Mentor CAD system
     only allows for 2 pads on a 2 contact component and 2) the EEs want as
     much part to pad contact as possible.

     Does anyone have experience and input on this question?

     TIA,

     Stu Korringa
     Smiths Industries
     Grand Rapids, Mi 49512
     616-241-8189
     [log in to unmask]

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