Thanks for the reply Peter.
I guess I'm just concerned about this increase in processing temperature. You
see it's not just the change to one or two companies processes, but a general
one worldwide. What will be the result of everyone processing ICs at elevated
temperatures?
Are the wafer fab and packaging companies aiming their products at these
temperatures or the traditional 180 degrees?
PCBs (PWBs) from one or two competent suppliers may be standing up to the new
temperatures, but what will be the result on all the suppliers. Are the PCB
(PWB) fab houses aiming their product at these elevated temperatures?
CONNECTORS and SWITCHES.....getting suppliers to make their plastics capable of
withstanding existing temperatures is difficult enough.
I wish that the SMART group was standing strong against the legislation.
I wish the DTI were standing strong against the legislation.
Instead there's an atmosphere of enthusiasm for the legislation while claiming
neutrality.
It's irresponsible to allow the electronics assembly world to dive headlong into
processing at elevated temperatures without the proper research being done and
the suppliers to that industry delivering products specified to work at these
temperatures.
Regards
Edward Brunker
______________________________ Reply Separator _________________________________
Subject: Re: [TN] Re[2]: European Union
Author: <[log in to unmask]> at INTERNET
Date: 17/03/99 17:56
In message <[log in to unmask]> [log in to unmask] writes:
> Peter,
> May I ask some questions regarding lead free?
Sure!
> What is the SMART groups view on the legislation?
The SMART Group doesn't have a "view", as such. However, what was clear at the
recent seminar was that lead free _will_ happen. The DTI (translation for US
readers = Department of Trade & Industry, UK Gvmt body) believe that the
proposed WEEE directive _will_ go through. Japanese companies _are_ producing
lead free products. The legislative and commercial drivers are very strong.
> Which alloys are the Japanese using?
This info was presented by various persons at the seminar - at lot of the
information comes from the DTI status report on lead free soldering which was
commissioned by the DTI and worked on by the NPL (National Physics Laborartory)
and ITRI (International Tin Research Institute) in the UK. This report will be
launched at and available from The SMART Group stand at Nepcon UK in Birmingham
next month. I am not sure when/how it will be available after that, but contact
SMART, STI, NPL or ITRI after the show. I believe it will be FOC.
The presentations from the seminar are available on The SMART web site
(http://www.smtuk.demon.co.uk - click on "Events"). IIRC, SnAgCu is probably
going to be the most widely used alloy. Also SnAg, SnCu. Some Bi containing
varieties will also be used.
> Which companies in Japan are manufacturing lead free product?
Toshiba, Hitachi, NEC, Matsushita and Sony all mentioned.
> Where do the Japanese obtain components with lead free terminations?
Good question! One of the limiting factors. Lead-free assemblers will be
scouring the world for terminations of NiPd et al!
> What is the SMART groups opinion on the solder alloys we should be
> using,
> M.P. in around 180 degrees C or
> M.P. at elevated temperatures of 220 - 230 degrees C?
Again, The SMART Group does not have an opinion itself. As a technology trade
association, we just provide the industry with a forum. However, IIRC the
alloys which will be used will be processed at 20-30 deg C higher than
currently. In other words, no exact drop in replacements are available, but
with a process change, it works. Alloys already mentioned.
As an aside, engineers from Nortel and Marconi Communications reported very
good reliability data with lead-free, as far as they have tested.
From what I have heard so far from various sources, reliability testing with
the usual lead-free candidates have shown "as good or better" joints than
conventional SnPb. Of course, the industry needs more extensive and long term
data - and we need to be doing this NOW.
> Regards
> Edward Brunker
> Senior Process Engineer
Peter Swanson
Vice President
The SMART Group
> ______________________________ Reply Separator
_________________________________ > Subject: Re: [TN] European Union
> Author: <[log in to unmask]> at INTERNET
> Date: 16/03/99 09:49
>
>
> In message <B12B12934C00D1119B8600805F4B98A00286D0@CSI> [log in to unmask]
wri > s:
> > One of our customers told us that the European Union is working on
> > eliminating lead and bromides from printed circuit boards by the year 2004.
> > Where can I get more information?
>
> This is true. Many major companies are now well into their lead-free programs,
> driven not only by the proposed European directive, but also by the fact that
> their competitors in the pacific rim are _already_ lead free in some
instances. > What do you think the buying decision will be when a consumer walks
into a
> store to buy a radio, sees two she/he likes, but one proclaims on a big
> label that it is "Lead Free" (probably a big _green_ label)?
>
> Information on the directive can be found on The SMART Group's web site
> (http://www.smtuk.demon.co.uk - click on the "News" hyperlink). The SMART
Group > also ran a very successful seminar on this topic very recently, and the
> presentations can be found on the site by clicking on the "Events" hyperlink.
>
> Peter Swanson
> Vice President
> The SMART Group
--
:::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::
Peter Swanson Oxfordshire, England
INTERTRONICS
[log in to unmask] http://www.cygnetuk.demon.co.uk
Suppliers of materials and consumables to the electronics & related industries
:::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::
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