Interesting, Bruce,
never went that far down on gold, and the Pd interlayer considered avoidable
cost ;
mainly because the standard Au/Ni flash I'm getting cheaper than HASL .
Did you solder on it ?; I'd be interested on reflow profile ;
if you bought it , on cost ;
and if you cycled it , on cycles/resistivities .

Sounds better than flash on contact ; not sure on solder and cost .
Can you reveal anything or is it one of those proprietary mums ?

thanks             paul

PS
Do you say you inspect to that four decimal ? (0.0625 !) ?
Envy you the gear !

> ----------
> From:         Bruce Stacy[SMTP:[log in to unmask]]
> Sent:         Thursday, 18 March 1999 8:27
> To:   [log in to unmask]
> Subject:      Re: [TN] Flash Gold and Switch Contacts
>
> What about 0.0625 - 0.125um Au/0.75um PdNI/4 - 5umNi?
>
>
>
>
> Paul Klasek <[log in to unmask]> on 03/17/99 06:07:46 PM
>
> Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>,
> Paul
>       Klasek" <[log in to unmask]>
>
> To:   [log in to unmask]
> cc:    (bcc: Bruce Stacy/ECSDOMAIN)
> Subject:  Re: [TN] Flash Gold and Switch Contacts
>
>
>
>
> Hi Jack
>
> I would not blame Hugo if he'd zap all of that gibberish I've send through
> and is hypothetically sitting in IPC archives for the generations to
> cherish
> ; but IF it's there; I did answered this one few times stating even cycles
> of carbon pill (on silicon membrane) switching onto flash gold pads (
> 10-20umNi + 0.5umAu ) .
> You were told correctly not to bother with selective plating ; unless
> specs
> or standards given will force you to do so .
>
> Keep the Ni up to 20um (micrometers ; not microinches) ; and the gold
> optimally 0.8-1.2um to be on safe side ;
> however we clocked 1 Million cycles on 0.5umAu on 5.3umNi ; as I wanted to
> be as far from embrittlement as possible ;
> ITRI states 1.5umAu tops as safe limit for solder ; our internal spec
> states
> top 0.8um .
> We go as low as 0.3umAu ( 3.0umNi )  on some batches (yes ; very pale)
> without problems and switching resistivity changes .
> Tried the Alpha Level (silver) ; lasted only 60K's , cycled with 1/8"
> carbon
> pill ; went through to copper ;
> the NiAu dynamic duo is hard to beat ; logically if you see the compatible
> characters for this particular application .
>
> And ; in couple of decades on gold and millions of telephones behind
> living
> to tell (previous life) ;
> I don't think there's better, cheaper and simpler way .
> The only thing is if you did not solder on gold before you'll have to work
> harder on process than on tin ;
> creeps on pads much slower .
>
> So, check the classics again ; let me know if you'd get stuck .
>
> See you Jack
>
> Paul Klasek
> http://www.resmed.com
>
> > ----------
> > From:         Jack Olson[SMTP:[log in to unmask]]
> > Sent:         Thursday, 18 March 1999 3:58
> > To:   [log in to unmask]
> > Subject:      [TN] Flash Gold and Switch Contacts
> >
> > I have just read through about a thousand messages regarding gold
> plating
> > in
> > the Technet archive, but still couldn't find exactly what I need to
> know:
> >
> > We have a design with one side all contact switch patterns, and the
> other
> > side SMT components. Since we wanted to gold plate the contact patterns,
> > we
> > were told to just gold plate the whole board.
> >
> > So the question is:  What gold thickness would be thin enough for the
> > SMT's
> > and still thick enough for good reliable contacts?  Or is there a better
> > way?
> >
> > thanks in advance,
> > Jack
> >
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