Ha!
my past comes back to haunt me....
Well, I have been TOLD by my SUPERIORS to plate 30u over 100u nickel, and I
am telling them that that's too much gold for the SMT, but of course since
I'm "the new guy" here they need to hear it from "a reliable source" too...
(and 5u seems a little thin for contacts, I'll check into the carbon, never
tried that)
thanks everyone for the responses, I'm collating and summarizing
onward thru the fog,
Jack
-----Original Message-----
From: David J. Ricketts [mailto:[log in to unmask]]
Sent: Wednesday, March 17, 1999 3:02 PM
To: 'Jack Olson'
Subject: RE: [TN] Flash Gold and Switch Contacts
Jack, Jack, Jack, Jack,
All that time at the company formerly known as B/E, and you
still have gold
questions?
If the switch area is a contact surface, like a push button,
then consider
screening carbon ink. Otherwise, you can flash nickel and
gold, 100 and 5
microinches max.
If it is a wear surface, like fingers wiping on the surface,
then you need
electrolytic gold.
So what kind of grass do they grow in that new valley of
yours?
David
MMI Designs
voice> 949-675-7360
fax> 949-673-3650
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jack
Olson
Sent: Wednesday, March 17, 1999 9:58 AM
To: [log in to unmask]
Subject: [TN] Flash Gold and Switch Contacts
I have just read through about a thousand messages regarding
gold plating in
the Technet archive, but still couldn't find exactly what I
need to know:
We have a design with one side all contact switch patterns,
and the other
side SMT components. Since we wanted to gold plate the
contact patterns, we
were told to just gold plate the whole board.
So the question is: What gold thickness would be thin
enough for the SMT's
and still thick enough for good reliable contacts? Or is
there a better
way?
thanks in advance,
Jack
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