In a message dated 3/17/99 8:58:59 AM Pacific Standard Time,
[log in to unmask] writes:

> Are there any issues with
>  running curing first and then running reflow?  After the glue is cured, it
>  will be passing through the oven during reflow at a higher temperature than
>  the curing temperature.  Will the reflow temperature have any effect on the
>  glue?

Hi Rob!

You shouldn't have any problems with temperature, as I have in the past run
boards where we've stenciled paste, and then dispensed glue, then run the
board through the oven reflowing the paste and curing the glue at the same
time. The reason I did this was because of the layout of the bottomside board
wasn't good, and we would have a lot of defects when depending only on the
wave to provide the solder connections.

BUT, unless you're no-clean, you'll need to wash the boards after reflow,
which I imagine will cause you a bunch of problems with the components that
are epoxied only on the bottom side.

My 'druthers are to try and avoid the use of glue if I can by doing a double-
reflow, and hand soldering  the through-hole (if it's minimal), or getting a
wave solder fixture made to mask off the SMT and exposing the PTH to the wave.
If you can't do either, I'd recommend you stay with the traditional
method...the one you're using now.

-Steve Gregory-

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