Guys,
We are designing a board with 40 mil BGA (1mm) on it. I am planning to have
bottom side non-vias plugged to prevent flux going into the vias during wave
while at the same time topside vias open. Fab house do not prefer plugging
from the both ends. Board has Ni-Ag surface finish.

How practical it is on 40 mil BGA as I do not see any problem on 50 mil
pitch BGA? Has any one done this way? I reason I do not want to mask from
the topside from cleaning point of view. Any comments.

re,
Ken Patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################