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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 17 Mar 1999 11:46:33 -0600 |
| Content-Type: | text/plain |
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Matthew,
What type of adhesive are you using and what is the finish on
your boards? Also, what type of solder mask are you using?
Thanks in advance.
Wade
-----Original Message-----
From: Matthew Park [SMTP:[log in to unmask]]
Sent: Wednesday, March 17, 1999 11:33 AM
To: [log in to unmask]
Subject: Re: [TN] Smt process
Your process is backward. We run and cure gluing first and flip
the process over, and print & pick/place and reflow. Didn't
have
any problem so far with cured glue and losing cured
components.
Matthew Park
Norsat International Inc.
>>> <[log in to unmask]> March 17, 1999 8:24 am >>>
We are in the process of determining the most efficient way to
run our smt
process. Right now we only have a half line and are looking at
adding the
back half of the line. Our current process takes us through
reflow first,
flip the product, then move the product to the beginning of the
line and
then run the bottom side (curing). If we use this current
process
with the
second half of the line, we will need to flip the product over
before it
reaches the hand insertion line. Our thoughts are can we run
bottom
(curing) first, flip the product, and then run top side
(reflow)?
This
will require us to only flip the product once. Are there any
issues
with
running curing first and then running reflow? After the glue is
cured, it
will be passing through the oven during reflow at a higher
temperature than
the curing temperature. Will the reflow temperature have any
effect on the
glue?
Rob Williams
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