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March 1999

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Subject:
From:
"<Joseph M. Webb>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 17 Mar 1999 11:51:07 -0500
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Fellow TechNeters,

Could you direct me to latest information on sources of, (manufacturers)
and results of any studies, on the application of solder alloys without
lead in HAL/HASL applications.

My most recent information suggests that tin alloys with silver, zinc,
bismuth and copper have varying degrees of popularity and performance
success, and I was hoping to start there.

Thanks in advance.

Joseph Webb
TET/Halco

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