It appears that you have few THT parts - they are all hand inserted.
If gluing is done first, Glued components can get knocked off during
processing second pass
( handling - standoff pins at print, pick and place, belt in case rail
option not there  ) .
In case you have good handling control and standoffs is not an issue at
print and P&P and rail option is available on reflow - it will be feasible
to reverse the process.

Most epoxies are stable and have insignificant weight loss upto 250 deg C.
Thus, reflow after gluecure should not be a problem.

-----Original Message-----
From:   [log in to unmask] <mailto:[log in to unmask]>
[SMTP:[log in to unmask]] <mailto:[SMTP:[log in to unmask]]>
Sent:   March 17, 1999 10:25 AM
To:     [log in to unmask] <mailto:[log in to unmask]>
Subject:        [TN] Smt process

We are in the process of determining the most efficient way to run our smt
process.  Right now we only have a half line and are looking at adding the
back half of the line.  Our current process takes us through reflow first,
flip the product, then move the product to the beginning of the line and
then run the bottom side (curing).  If we use this current process with the
second half of the line, we will need to flip the product over before it
reaches the hand insertion line.  Our thoughts are can we run bottom
(curing) first, flip the product, and then run top side (reflow)?  This will
require us to only flip the product once.  Are there any issues with running
curing first and then running reflow?  After the glue is cured, it will be
passing through the oven during reflow at a higher temperature than the
curing temperature.  Will the reflow temperature have any effect on the
glue?
Rob Williams

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
<mailto:[log in to unmask]>  with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org <http://www.ipc.org> )
"On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask]
<mailto:[log in to unmask]>  or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################