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March 1999

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Subject:
From:
Jim Zanolli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 12 Mar 1999 15:17:49 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines)
Teka Interconnection Systems can supply .025" pins as an assembly with
solder and flux pre-deposited allowing you to insert the pins from the
circuit side go right to chip shooter and then reflow without flipping the
PCB or adding solder paste. For more information contact me offline and/or
go to http://www.tekais.com

At 02:07 PM 3/11/99 -0800, you wrote:
>I am looking for information/advice on the potential pitfalls with
>pin-in-paste (have also heard it call intrusive reflow process).  We have an
>application where 4 to 8 (depending on the model) square .025", 1/2" long
>pins are to be inserted into a CEM1 single sided pcb.  The connection to the
>pins is made opposite to the circuit side of the board.  The circuit side of
>the board is populated with SMT chip caps, resistors and LED's.  Typical
>models will have less than 10 SMT parts.  The current process flow is:
>
>Solder Paste->Board Flip->Pin Insert->Board Flip->Chip
>Shooter->Clean->Reflow-> etc..
>
>We are investigating being able to insert the pins from the circuit side to
>eliminate the extra handling steps.
>
>Thanks in advance for your help.

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