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March 1999

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Date:
Mon, 1 Mar 1999 07:14:05 EST
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Subj:   Re: [TN] Help!! Big problem (solder resist vs die attach)
Date:   27/02/99

Tell manufacturing to use a nonconductive adhesive.
They should have no problem going back to their adhesive supplier and
identifying a non conductively filled version of the resin system they
presently use - which will answer the next objection. THis will give them
desirable minimal change  and almost identical handling and cure
characteristics  etc for easy change over.
The only reason - apart from ease of ordering and similar -  for using an
electrically conductive adhesive on a non electrically conductive surface is
for its thermal conductivity, so you might like to check that out before
making your suggestion.


Mike Fenner
............
In a message dated 25/02/99  07:27:17PM,  [log in to unmask] writes:

>
>  Hi Designers,
>
>          I'm in need of help!  I have completed a design with some L157 IC's
>  on the Board. And Manufacturing came back to me after I finished the design
>  and was about to ship it and said that they use a conductive epoxy to
>  adhere the die to the Board and they're worried that if the Solder Resist
>  has pin holes in it that it could leak a signal into the runners below
>  those Die.  They said they could use Pre-Forms but that would kill their
>  yeild so they want me to reroute the traces below those die. Unfortuatley
>  that would be a nightmare and add at least a week to my time.  So can
>  anyone tell me where I can get info to help prove that this won't be a
>  problem or are they right and there's a good possiblitiy that this could
>  happen.
>
>  Thank you,
>
>  Greg Bodi
>

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