Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 1 Mar 1999 07:14:05 EST |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Subj: Re: [TN] Help!! Big problem (solder resist vs die attach)
Date: 27/02/99
Tell manufacturing to use a nonconductive adhesive.
They should have no problem going back to their adhesive supplier and
identifying a non conductively filled version of the resin system they
presently use - which will answer the next objection. THis will give them
desirable minimal change and almost identical handling and cure
characteristics etc for easy change over.
The only reason - apart from ease of ordering and similar - for using an
electrically conductive adhesive on a non electrically conductive surface is
for its thermal conductivity, so you might like to check that out before
making your suggestion.
Mike Fenner
............
In a message dated 25/02/99 07:27:17PM, [log in to unmask] writes:
>
> Hi Designers,
>
> I'm in need of help! I have completed a design with some L157 IC's
> on the Board. And Manufacturing came back to me after I finished the design
> and was about to ship it and said that they use a conductive epoxy to
> adhere the die to the Board and they're worried that if the Solder Resist
> has pin holes in it that it could leak a signal into the runners below
> those Die. They said they could use Pre-Forms but that would kill their
> yeild so they want me to reroute the traces below those die. Unfortuatley
> that would be a nightmare and add at least a week to my time. So can
> anyone tell me where I can get info to help prove that this won't be a
> problem or are they right and there's a good possiblitiy that this could
> happen.
>
> Thank you,
>
> Greg Bodi
>
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|