I am looking for information/advice on the potential pitfalls with
pin-in-paste (have also heard it call intrusive reflow process).  We have an
application where 4 to 8 (depending on the model) square .025", 1/2" long
pins are to be inserted into a CEM1 single sided pcb.  The connection to the
pins is made opposite to the circuit side of the board.  The circuit side of
the board is populated with SMT chip caps, resistors and LED's.  Typical
models will have less than 10 SMT parts.  The current process flow is:

Solder Paste->Board Flip->Pin Insert->Board Flip->Chip
Shooter->Clean->Reflow-> etc..

We are investigating being able to insert the pins from the circuit side to
eliminate the extra handling steps.

Thanks in advance for your help.

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