Hello Roger,
we routinely mount BGA's onto the same types of socket adaptors you speak of
for all prototype development because of software changes. What we do is
spray the BGA balls and the socket with a no-clean flux, place the BGA onto
the socket, and reflow through the oven normally. It is not necessary to add
solder paste. Our yield is 100%.
Good Luck,
Russ Vertefeuille
Sr. Project Eng.
> -----Original Message-----
> From: Roger Massey-G14195 [SMTP:[log in to unmask]]
> Sent: Wednesday, March 10, 1999 2:20 AM
> To: [log in to unmask]
> Subject: [TN] BGA Sockets
>
> Hi TN,
>
> Has anybody out there in the "real world" ever had cause to solder a
> BGA onto a socket so that it turns into a Pin Grid Array? I need to
> make up some test boards for a customer, and we dont have the BGA at
> the minute, but the electrical folks want to test their design
> without
> waiting for the BGA to arrive. Some body found a supplier who can
> supply an adaptor, which is essentially a piece of FR4 with enough
> pins to cover all the balls. One end of each pin has a small cup to
> take the ball, while the other is a standard pin.
>
> It seems a simple enough idea, place the BGA and reflow, has
> anybody done this before, or something similar?
> Do you think it likely that the I will need more solder paste in
> the cups? Looking at the cup size, and the ball size I think I may
> have to add some paste, but the cups stick up nearly 2mm from the
> FR4,
> so printing is not really that suitable, could dispensing be a
> better
> bet (dont have any experience in that!)
>
> Any help would be appreciated,
>
> Thanks
> Roger
>
>
> Roger Massey
> Motorola AIEG
> UK
>
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