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March 1999

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 10 Mar 1999 09:42:55 +1100
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Hi Bill

Bear with me if I'd sound too full of it  :

Did you ? actually try to solder onto that gold plate (when you say gold
leads ; it's not 24c Au wire is it ?) .
We solder gold plate on gold pads, with bit slow creep ; but ok ; am I
missing something ?
This tin exercise would terrify me if I'd be a 25 pack .

On the dispensing, on 642 head I presume, 25 gauge needle with 400/500 mesh
will do you fine .
You may have to stagger the dots (toe;heel;toe;heel...) and indium NC-SMQ90
would keep you shorts out; it wicks onto metal like mad (check my files)
Be on toes with camelot now as the speedline reshuffle did not help
expertise and service levels ;
previously of very high standards .

See you

Paul Klasek
http://www.resmed.com

> ----------
> From:         Kasprzak, Bill (esd) US[SMTP:[log in to unmask]]
> Sent:         Wednesday, 10 March 1999 3:45
> To:   [log in to unmask]
> Subject:      [TN] : How to Tin Actel-CQ132
>
> Fellow techies:
>
> We are going to be using an Actel CQ132 Ceramic Quad Flatpack (25 mil
> pitch). From a process standpoint I have ordered a die from Fancort to
> form
> the part, and we will be dispensing solder paste through a Camalot
> Poisitve
> Displacement pump (can't stencil due to component location), component
> will
> be placed then run through my Heller 1088 reflow system. All this forming
> and dispensing stuff is new to me but the pitch and the reflow is not.
>
> There is one part of the process that I'm taking for granted and that is
> the
> tinning of the part. The part is received with gold leads.(Doesn't come in
> anything but gold, and besides, the part will not form well with solder on
> the leads)  I'm assuming that after the part is formed, I can dip the feet
> of the formed part in RMA flux then tin in a 500 degree F solder pot like
> any other part, one side at a time. I would then clean the part in
> Flux-Off-CZ then place into my matrix tray to hold until placement time.
> I'll probably use a vacuum pencil to hold the part.
>
> Is the tinning of this part as routine as I think its going to be or do I
> need to worry about another new process ?  Recommendations are needed.
>
> Bill Kasprzak
> Moog Inc.
>
> (Have we hit the 2000 mark yet ? [Just havin' fun Steve, I know how it
> feels])
>
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