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March 1999

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Subject:
From:
Richard Haynes <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Mar 1999 20:58:53 -0500
Content-Type:
text/plain
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Darrel,
To be on the safe side I would specify ranges of temperatures and %RH and
other corrosion gases for every environment your products is exposed to so
the customer knows and must abide by or the product is not considered to be
at fault.

Extrapolation of data is not always reliable. Often Aging studies will start
25%  stated ranges sometimes with suprises.

Richard Haynes
609-497-4584

-----Original Message-----
From: Darrel Therriault <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, March 08, 1999 8:36 PM
Subject: [TN] Solder Joint Reliability


>Technet,
>
>A customer has asked some environmental questions relative to the effect of
>temperature.  We specify our operating range as 10c to 35c, but did not
>test outside this range to the level the customer has requested data for.
>I was wondering if extrapolation of the data we do have would be meaningful
>and possibly acceptable?
>
>We do not specify a non-powered or storage temperature range.  Should we do
>this??
>
>For the components we use, the powered and storage temp ranges are all
>specified in the data books and we are well within all of those
>specifications.
>
>I was trying to find some data on solder joint reliability, but could not
>find anything significant.
>Is there a graph or calculation that will show the effect of temperature on
>solder joint reliability for different parameters??  I would guess solder
>composition, pad size, joint size and material CTE might all have something
>to do with it, but can't seem to find anything definitive.
>
>Any assistance or observation would be appreciated.
>
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