TECHNET Archives

March 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Daan Terstegge>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Mar 1999 22:48:47 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (74 lines)
Hi Bill,

For smaller quantities (less than thousand components) I'd
recommend tinning while the QFP still has the tiebars. You only
need a tinpot (or maybe two) and a tool to control the immersion
depth.
Of four componenttypes (all formed in Fancort tools) we only have
one that has some problems with tin scraping from the leads. Tin
buildup in the tool should be cleaned every now and then.

Regards,

Daan Terstegge



Date sent:              Tue, 9 Mar 1999 09:45:00 PST
Send reply to:          "TechNet E-Mail Forum." <[log in to unmask]>,
                "Kasprzak, Bill (esd) US" <[log in to unmask]>
From:                   "Kasprzak, Bill (esd) US" <[log in to unmask]>
Subject:                [TN] : How to Tin Actel-CQ132
To:                     [log in to unmask]

> Fellow techies:
>
> We are going to be using an Actel CQ132 Ceramic Quad Flatpack (25 mil
> pitch). From a process standpoint I have ordered a die from Fancort to form
> the part, and we will be dispensing solder paste through a Camalot Poisitve
> Displacement pump (can't stencil due to component location), component will
> be placed then run through my Heller 1088 reflow system. All this forming
> and dispensing stuff is new to me but the pitch and the reflow is not.
>
> There is one part of the process that I'm taking for granted and that is the
> tinning of the part. The part is received with gold leads.(Doesn't come in
> anything but gold, and besides, the part will not form well with solder on
> the leads)  I'm assuming that after the part is formed, I can dip the feet
> of the formed part in RMA flux then tin in a 500 degree F solder pot like
> any other part, one side at a time. I would then clean the part in
> Flux-Off-CZ then place into my matrix tray to hold until placement time.
> I'll probably use a vacuum pencil to hold the part.
>
> Is the tinning of this part as routine as I think its going to be or do I
> need to worry about another new process ?  Recommendations are needed.
>
> Bill Kasprzak
> Moog Inc.
>
> (Have we hit the 2000 mark yet ? [Just havin' fun Steve, I know how it
> feels])
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2