Bob,

One question to ask:  Is the mask your using polyalcohol developable or
carbonate developable? The polyalcohol types tend to be more resistant from
the gold solutions that carbonate.

        -----Original Message-----
        From:   Robert Jordan [SMTP:[log in to unmask]]
        Sent:   Tuesday, March 09, 1999 11:28 AM
        To:     [log in to unmask]
        Subject:        [TN] Immersion Ni/Au & Solder Mask

        Hello Techneters,

        I would like to solicit you comments, experiences, suggestions and
        hopefully success stories concerning the processing of Immersion
        Nickel/Gold with respect to LPI Solder Mask adhesion.
        Presently, we solder mask first then send out to subcontractors for
        Immersion Nickel/Gold. We use Tayio PSR4000AD as well as PSR4000BN.
From
        time to time we see peelers, leakers whatever you would like to call
it.
        The same solder mask performs fine in HASL and Entek enviroments.
I'am
        stumped. Are any of you runing a 6 sigma process reguarding this?

        Areas in question include;
        * Surface prep prior to LPI
        * LPI mask itself ...ie manufacturer?
        * Exposure and Development
        * Final Cure
        * Immersion Nickel/Gold
           Type/Manufactures
           Operation parameters ... ie temperature, concentrations, pH, time
           Thickness of Nickel deposit
        * Should we Immersion Nickel/Gold before mask?
        * Mystery or Magic?

        Thank You,
        Robert Jordan
        408-738-0693  x1116

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