Fellow techies:

We are going to be using an Actel CQ132 Ceramic Quad Flatpack (25 mil
pitch). From a process standpoint I have ordered a die from Fancort to form
the part, and we will be dispensing solder paste through a Camalot Poisitve
Displacement pump (can't stencil due to component location), component will
be placed then run through my Heller 1088 reflow system. All this forming
and dispensing stuff is new to me but the pitch and the reflow is not.

There is one part of the process that I'm taking for granted and that is the
tinning of the part. The part is received with gold leads.(Doesn't come in
anything but gold, and besides, the part will not form well with solder on
the leads)  I'm assuming that after the part is formed, I can dip the feet
of the formed part in RMA flux then tin in a 500 degree F solder pot like
any other part, one side at a time. I would then clean the part in
Flux-Off-CZ then place into my matrix tray to hold until placement time.
I'll probably use a vacuum pencil to hold the part.

Is the tinning of this part as routine as I think its going to be or do I
need to worry about another new process ?  Recommendations are needed.

Bill Kasprzak
Moog Inc.

(Have we hit the 2000 mark yet ? [Just havin' fun Steve, I know how it
feels])

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