Technet,

A customer has asked some environmental questions relative to the effect of
temperature.  We specify our operating range as 10c to 35c, but did not
test outside this range to the level the customer has requested data for.
I was wondering if extrapolation of the data we do have would be meaningful
and possibly acceptable?

We do not specify a non-powered or storage temperature range.  Should we do
this??

For the components we use, the powered and storage temp ranges are all
specified in the data books and we are well within all of those
specifications.

I was trying to find some data on solder joint reliability, but could not
find anything significant.
Is there a graph or calculation that will show the effect of temperature on
solder joint reliability for different parameters??  I would guess solder
composition, pad size, joint size and material CTE might all have something
to do with it, but can't seem to find anything definitive.

Any assistance or observation would be appreciated.

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