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March 1999

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Subject:
From:
Stephen Ayotte <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Mar 1999 15:23:36 -0500
Content-Type:
text/plain
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text/plain (62 lines)
A quality organization that I work with has a number of questions
concerning the use of solder pots, techniques, limits, conditions,
constraints as they relate to solder shock testing of laminates.  They are:


I need some information concerning the expiration of 63/37 solder when
used in a solder pot.
I have looked for any kind of standard that
would describe a time limit for the solder, but haven't found a thing.
We thermally stress circuit boards at 550o F (288o C
) for ten seconds, referencing test method IPC-TM-650, Number 2.6.8.,
revision
C, date 8/97, sections 5.4 - 5.6.
But how often should we replace the solder ?
Is there a time constraint or quantity constraint that dictates when
to replace the solder with new material ?

In addition, is there any information concerning the procedure for
replacing
the solder in the pot ?
Is there a percentage of copper that must be added to the 63/37 tin/lead
solder ? Or some other preparation needed for proper solder flow.

Please respond to my e-mail address with any pertinent information that
will assist me.
I would also recommend adding this information to your test methods
IPC-TM-650 for other industries to reference.

Look forward to hear from you.
Sincerely,

Christopher S. Barton

IBM Corporation
[log in to unmask]

Are there specific directions with which the testing is to be performed;
side to be floated, flip coupon between floats when doing multiple tests,
cool down technique, bakes before floating, etc?

Thx.



Stephen Ayotte, IMD Product Quality Engineer
Dept. 5QE, Bldg. 14-3, Office BB11
Phone (607) 755-1537,    t/l 855-1537
Pager (607) 755-7243 Pin #863 - external,    5-8888 Pin 2863 - internal
Fax      (607) 755-4649

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