In a message dated 3/5/99 13:34:22, you wrote:
>Werner,
>>        Thank you for your response.  The part is not bare Beryllium Copper
>but is finished per MIL-G-45204 Type 1 with 5 micro-inches of Hard Gold.  We
>are experiencing some of these parts coming off the PCB from vibration
>during shipment to us from our sub-contract assembly house.  We are looking
>at all options and wanted to solicite other options.
>Wes

Hi Wes,
I fully understood that your BeCu was covered with Au. There is no way you can
solder to Au (well maybe to an ingot in Ft. Knox), it simply disolves too
rapidly in the Sn. Au promotes the spreading (not the wetting) of the liquid
solder over the underlying surface, and, as I indicated, BeCu has a bad
history of poor wettability (= metallurgical bonding) with solder.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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