Hi Earl
Looks to me somewhat close to the envelope
Anything is "kind of" possible, process capability, ppm defectives are the
concerns, not that "MOST" boards are pretty good.
Can you just allow the boardshop the move the trace a few mils away from the
pad ?
I think you mentioned that there was space on the "other side"
And of course, follow up with a documented ECO.
Wolfgang
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, March 06, 1999 10:05 AM
Subject: Re: [TN] LPI Solder Mask Limitations and Capabilities
>
>
>> ----------
>> From: [log in to unmask][SMTP:[log in to unmask]]
>> Sent: Saturday, March 06, 1999 10:05:05 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] LPI Solder Mask Limitations and Capabilities
>> Auto forwarded by a Rule
>>
>Kieth,
>
>I thank you. My concern is what the "average" top 10% board shop can do. I
know this is a loaded
>question, but we have serious problems concerning a near 5 mil gap between
a trace running parallel
>to a 432 ball perimiter BGA pad pattern with obvious shorting/bridging
problems. On about 50% of our
>boards, received from a "top 10" shop, conductor edges are visible causing
shorting, without serious
>touchup (with silk screen epoxy hand applied goop) efforts.
>
>I believe what you say. I know in my heart, as I have wittnessed it first
hand, what you say can be
>done. You say routinely and I do not question, but how routinely and under
what conditions? What
>kind of controls, or process management efforts, must be employed from
photoplotting through resist
>stripping?
>
>Thanks and high regards,
>
>Earl Moon
>
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