TECHNET Archives

March 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Arroyave, John (FL51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Mar 1999 09:40:03 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
Does anyone know of a manufacturer or vendor that may make or sell this
product, if it exists?  We are basically looking for individual preform
"doughnuts" that are held in place by Kapton or some other similar material,
that can be removed after re-flow.  I looked into Winslow Automation's
SolderQuick product, but apparently they only do re-balling for BGAs on
Kapton like material.  Any information would be greatly appreciated.

Thanks,

John Arroyave
SMT Production Engineer
Honeywell Space Systems
Phone:          (727) 539-2272
Fax:    (727) 539-4469
e-mail: [log in to unmask] <mailto:[log in to unmask]>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2