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Sun, 7 Mar 1999 10:58:20 -0600 |
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multipart/mixed; boundary="------------1B057C06724FD10AF515BEE4" |
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Circuit Technology Inc. |
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1.0 |
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Hi John,
Did you ever get an answer to your request? I have several recommendations on MIL approved polyimide
fabricators doing wire bondable Au. If you can tell me a little about the board technology (layer count,
smallest holes and traces, anything "unusual", etc) and whether you need quick turn and/or production I can
point you in the right direction.
Best regards,
Keith Larson
Circuit Technology Inc.
"Vaughan, John" wrote:
> Good afternoon:
>
> We are researching for a source of supply for Mil-approved printed circuit
> on polyimide materials that is capable of supplying gold wire bond plating.
> All assistance appreciated.
>
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