Hello there,
I would like to know if there are general specs (min. & max.) for the
distance between edge of DIE pad to the edge of footprint... How
about the minimum length and pitch of pads used for the
wirebond... I was asked to do a design for COB (first time) so I
would like to check the parameters that must be considered in doing
the design... Thank you very much in advanced for your replies
regarding this matter.
Regards,
JB
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