Can anyone help with recommendations for ionic contamination
specifications of rigid and flexible circuits. I am responsible for
the manufacture of electronic assemblies both flexible and rigid.
Rigid - 2oz Copper(double sided)
Flexible - 20z copper/mylar laminate (single sided)
3 of the flexible circuits are operated in Static Positions and 1
operates in a dynamic position (specification of 5K+ flexing cycles)
Also if there is a web site which may contain some of this information
I would appreciate the address?
Being new to ionic contamination I guess the specification is aimed at
protection from possible micro etching agents etc. which effect Early
Life failure rates - is this correct?
Thank you for your time and support in advance.
Colin Leyden
Senior Engineer
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