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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 19 Mar 1999 13:27:55 -0800 |
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I am looking for more recent material on the growth, care and feeding of
Au/Al intermetallics in gold ball on aluminum IC pad wire bonds than George
G. Harman's excellent though all too brief book, "Wire Bonding In
Microelectronics" with a 1989 copyright. More specifically, I am interested
in known contaminants that reduce the time and/or temperature components
required to grow the intermetallic layer. I would also like to know what a
"typical" intermetallic layer thickness is, if there is such a thing as
typical.
I would greatly appreciate if someone would at least refer me to relevant
material.
Thank you.
Neal Forss
fax: (408) 738-8364
work: (408) 522-6304
email: [log in to unmask]
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