Hi,
Has anyone done any studies for the change of depth of solder paste
with wear on the stencil. Metal blade squeegees damage the stencil
over a period of time, yielding an uneven surface in the form of
furrows in the direction of travel. Any uneveness in the stencil is
going to hold the blades that much further off the board giving more
solder paste.
Any comments?
Regards
Edward Brunker
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