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March 1999

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Subject:
Thermal management of RF power surface mount packages
From:
Dave Elder <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 2 Mar 1999 16:47:37 +1200
Content-Type:
text/plain
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My RF engineer would like to use an MRF9382 RF Power
SM transistor on a low technology (read "cost") board.
Typical power dissipation for this device is 5-7 watts. CTE
mismatches create undesirable stresses if a metal slug is
used and Motorola recommend solder filled thermal vias.
Does anybody out there have any experience with design
and manufacture using such devices?

----------------------------------------------------
Dave Elder ([log in to unmask])
Tait Electronics Ltd, Christchurch, New Zealand
Tel: (64) 3 358-0327, Fax: (64) 3 359-4632

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