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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 16 Mar 1999 08:57:00 -0500 |
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Our multilayer SMT design utilizes SMOBC, the only surface pads are
terminations and test points, and yes, it's for military avionics. The vias
are filled with epoxy resin and then either coated with solder mask or plated
over on top with copper and then solder coated (via in pad) for test points.
For QFPs, usually the area under the component is an exposed solid metal
surface (solder coated) for heat dissipation. A film of thermally conductive
tape is used between the bottom of the component and the metal surface.
If you have any other questions, please call.
Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]
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