Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Sun, 7 Mar 1999 10:58:20 -0600 |
Content-Type: | multipart/mixed |
Parts/Attachments: |
|
|
Hi John,
Did you ever get an answer to your request? I have several recommendations on MIL approved polyimide
fabricators doing wire bondable Au. If you can tell me a little about the board technology (layer count,
smallest holes and traces, anything "unusual", etc) and whether you need quick turn and/or production I can
point you in the right direction.
Best regards,
Keith Larson
Circuit Technology Inc.
"Vaughan, John" wrote:
> Good afternoon:
>
> We are researching for a source of supply for Mil-approved printed circuit
> on polyimide materials that is capable of supplying gold wire bond plating.
> All assistance appreciated.
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################
|
|
|