TECHNET Archives

February 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
{Ron Waugh} <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 1 Feb 1999 13:21:28 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (67 lines)
T.J.,

In the January issue of SMT there is an article about what you are looking
for.  It starts on page 70.  If you don't have access to this particular
issue let me know and I'll fax it to you.  Hope this helps?

Thank you,

Ron Waugh
Manufacturing Engineer

SMC, Inc.
1729 Jaggie Fox Way
Lexington, KY 40511

Phone:  (606) 253-3066
Fax:       (606) 254-2870
E-mail:  [log in to unmask]


-----Original Message-----
From: T.J. Baltrusaitis II [mailto:[log in to unmask]]
Sent: Monday, February 01, 1999 12:16 PM
To: [log in to unmask]
Subject: [TN] Solder Paste volume Standards


Is there a formula for calculation of optimum solder paste volumes for given
endcap or lead configurations if pad size is known? I am in the process of
programming vision machines to accept/reject PCBs based on solder volumes. I
would like to know also if any standards exist for optimum solder volumes
that
result in optimum solder filets on IC leads and chip endcaps. I want to
start
with something easy, like 0805 capacitors and resistors. We currently go by
past
experience, but would like to standardize solder paste brick volumes for
specific components wherever possible. If anyone has any info on this,
please
respond. Thanks.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2