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February 1999

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Subject:
From:
Lenny Kurup <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Feb 1999 13:14:52 -0500
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (41 lines)
Hello Henry,

Providing the foil deposit was obtained within the same current density
range, as your plated parts, you should not have any problems obtaining
triple nine gold, and hence, with the stated thickness, no problems wire
bonding, with regards to the gold deposit.

Lenny Kurup
EMX Enterprises Ltd.

On Wed, 3 Feb 1999, Henry Coulter wrote:

> I just had my soft gold tank analyzed (foil analysis) . Purity is 99.9%
> knoop hardness is 70. Can it be assumed that the parts plated in this tank are wire bondable assuming they are plated at the proper ASF
> (1-5 asf) and the gold and nickel thickness is adequate (nickel 100-200. Gold 20-60 microinches)? Parts are cleaned with plasma machine using 100% oxygen at 600 watts for 30 minutes prior to shipping to customer. Any light shed on this subject will be greatly appreciated. Thanks in advance.
>
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