Yeah, sounds like the plating should be Au wire bondable.

        A couple of things to keep an eye on, try and keep the total Ni,Cu
     and Pb concentrations below 50ppm and also ensure that there is no
     Thallium in the plating (14ppm Th has been reported to be sufficient to
     give problems with bonding and bond reliability).   The other thing to
     watch is the presence of H, the best way to look for this is anneal the
     Au, and look for outgassing.

        I would have thought that you are putting a bit much Ni down
     (50-100 uin is acceptable for a diffusion barrier) and try and keep
     the Au layer closer to the 40-60 uin area to aavoid the hardness of
     the Ni showing through.

        The best test is still to slap it onto a bonder and run a couple
     hunderd wire on the stuff.

                Good luck


     Roger Massey
     Motorola AIEG
     UK


______________________________ Reply Separator _________________________________
Subject: [TN] Soft gold purity,hardness and bondabilty
Author:  "TechNet E-Mail Forum." <[log in to unmask]> at #email
Date:    03/02/99 16:23


I just had my soft gold tank analyzed (foil analysis) . Purity is 99.9%
knoop hardness is 70. Can it be assumed that the parts plated in this tank are
wire bondable assuming they are plated at the proper ASF
(1-5 asf) and the gold and nickel thickness is adequate (nickel 100-200. Gold
20-60 microinches)? Parts are cleaned with plasma machine using 100% oxygen at
600 watts for 30 minutes prior to shipping to customer. Any light shed on this
subject will be greatly appreciated. Thanks in advance.

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