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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 3 Feb 1999 17:18:12 EST |
Content-Type: | text/plain |
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Hi Brian,
I agree it likely has nothing to do with the energy transfer. It is however
possible, that if they use a rather thick solder paste stencil, thus placing a
large solder volume; and that depending on the velocity of your convection
gas jets, your machine may press the components more down squeezing more
liquid solder from underneath the leads and causing an increase in shorts.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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