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Subject:	Solder Bridging
From:	Energy Technology Systems <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 3 Feb 1999 10:58:01 -0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (38 lines)

I have a customer who recently replaced a very old IR reflow oven with a
brand new convection one. Since the new oven has been installed they are
noticing an increase in solder bridging on some very fine pitch components.
Even the customer says that they do not suspect the reflow oven but they
cannot place a finger on it. Being the manufacturer of this oven I want to
help prove that it is not the problem as none of our other customers have
ever complained about solder bridging and from my experiences solder
bridging has been reduced dramatically when switching from IR to Convection.
Can anyone suggest additional places to look.

The area I am most suspect of is the conveyor just prior to reflow. The
reflow has an edge conveyor and the linking conveyor just prior to reflow is
"power loading" the boards. By power loading I mean the upline conveyor is
running considerably faster so that the boards slide a ways onto the
conveyor prior to slowing to match the reflow conveyor speed. I have heard
that boards can crash into the conveyor pins, other boards, etc. when power
loaded and cause components to shift. Could this be the case?

I know it can not be related to the energy transfer as the delta on their
boards was reduced from 40 degrees C to less than 15 (actually 8 - 15
degrees depending on the board) by switching from IR to convection.

Comments?

Brian

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