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| Reply To: | TechNet E-Mail Forum. |
| Date: | Thu, 25 Feb 1999 16:58:04 +0000 |
| Content-Type: | TEXT/PLAIN |
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On this subject, I have recently been investigating an open circuit problem
with a multilayer board and have found a small, but significant, level of foil
cracking at the hole / inner layer interface with no apparent reason. There are
no unused pads and I had already been pondering whether the lack of these
"dummy" pads could result in more stress on the inner layer junctions during
thermal shock - 288 C for 10 seconds. Maybe any weaknesses in the junction are
more likely to result in fracture if there are no dummy pads ?
Comments, anybody.
Bryan
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