Hi Designers,

        I'm in need of help!  I have completed a design with some L157 IC's
on the Board. And Manufacturing came back to me after I finished the design
and was about to ship it and said that they use a conductive epoxy to
adhere the die to the Board and they're worried that if the Solder Resist
has pin holes in it that it could leak a signal into the runners below
those Die.  They said they could use Pre-Forms but that would kill their
yeild so they want me to reroute the traces below those die. Unfortuatley
that would be a nightmare and add at least a week to my time.  So can
anyone tell me where I can get info to help prove that this won't be a
problem or are they right and there's a good possiblitiy that this could
happen.

Thank you,

Greg Bodi

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