Ryan,
        You may want to try increasing the time and temperature of the
'soak' portion of your profile. Due to the mass of the part, you can't
throw all the heat required at it in the reflow zone alone. In addition,
higher spike temps and longer time above liquidous may be required.
Doing P-I-P of large components can be 'iffy', and sometimes cannot be
achieved without compromising other critical parameters of your profile.
Even if you see reflow at the pins on the bottom of the board, use x-ray
to assure that you also reflowed everything you overprinted on the top,
or cross section some joints to verify. We do quite a bit of P-I-P on a
variety of customers' products, it's an ongoing balancing act between
stencil design/paste volume/barrel fill/material
compatability/successful reflow. Good luck

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Ryan Jennens [SMTP:[log in to unmask]]
> Sent: Thursday, February 25, 1999 10:08 AM
> To:   [log in to unmask]
> Subject:      [TN] Pin-in-paste problem
>
> Mornin everybody-
>
>         We just tried running our first pin-in-paste (paste-in-hole,
> etc.) process
> for manufacturing a board which has only four through-hole parts.
> Everything went well except for a 9-pin Amp D-subconnector.  This part
> did
> not solder because it seems that we could not get enough heat to the
> part.
> The paste did not reflow and the parts around it did not either
> (surface
> mount included).  Can you suggest any ways to heat up this big
> "heatsink" of
> a part and get the pins (underneath the connector) to reflow?
>         And Steve-  I am still working on your explanation.
>
> Ryan Jennens
> TelGen Corporation
>
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