We are faced with creating a "hybrid" made with an ASIC on one side and a
custon Ceramic device (abt 0.50" square) on the opposite side.  The ASIC
will be mounted up-side down to the ceramic "interboard." The "hybrid" will
then be attached to an FR-4 board in the conventional manner.

We will be building these in panel form. The ceramic between the two parts
after de-paneling will be .040" thick, and about .6" by .6" square.  There
will be .25" spacing between rows of parts. Each panel will be about 4"
square.

I am lookig for suggestions in a couple of areas:
1. What is the best way of "scoring" the ceramic so things don't get broken
and people don't get hurt when snapping the panels apart.
2. What would be the suggested elevation of temperatures in a seven-zone
oven to compensate for the ceramic as compared to an FR-4 board?

TIA for any input.

Charlie B.

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